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All the latest news
March 27,2007
Zuken’s
Latest Version of CR-5000 Supports the Latest High Speed Technologies and Devices Including DDR Memory and High Density FPGAs
May 8th, 2007 - Munich, Germany and Westford, MA , USA – Zuken launches
CR-5000 version 10.0, the enterprise-wide printed circuit board (PCB) design solution. The highlights include advanced methodologies
to support high-speed differential pairs essential for DDR design, further developments related to routing technology, and
enhancements to integration and design flow. The Dominant
Differential Pair With around 90% of designs now featuring
differential pairs, Zuken has made quick and efficient handling of this technology a focus for CR-5000 10.0. Differential
Pairs can now be seamlessly managed and constrained throughout the design flow by the engineer, delivering increased design
consistency by front loading the design process. Version 10.0 also supports many additional topology styles for differential
pairs - which are essential for architectures such as DDR2 and DDR3. Zuken’s Trunk router, optimized for differential
pair design, has also been updated to support full interactive routing of these topologies. Routing for Quality and Speed As the global pioneers of ‘Trunk’ routing technology (launched in 2005) Zuken continues to invest time
in further developing the environment’s strong competencies in interactive and automatic routing. Version 10.0 of Lightning,
the high-speed environment in CR-5000, has seen vast improvements to interactive functionality relating to H-Tree topologies,
guaranteeing zero skew routing of bridge- and shunt-terminated H-Trees. It is also now possible to dynamically re-lengthen a net in order to meet constraints during routing operations.
In addition, existing lengthening blocks in a net are now automatically re-lengthened in preference to adding new blocks. Integration and Design Flow Within revision 10.0 significant focus has been directed at increasing the design/electrical engineers
involvement within the product design flow by further improving the bi-directional communication between different CR-5000
applications. Deeper integration between system level and board level environments, CR-5000 System Designer and CR-5000
Board Designer, means that CR-5000 Lightning can now be used by engineers as an engineering floor planning tool – saving
time and increasing design quality as a result of further front loading of the design process. Support for multiple template copper pour layers has simplified design for manufacturing of
complex multi-layered boards by making it easier to manage multiple copper areas throughout the design flow. Modeling and Simulation Facilitating adoption of latest buffer technologies, CR-5000 10.0 also supports IBIS 4.2, IBIS terminator models,
IBIS series elements and SPICE mutual inductance elements. By adding powerful features such as smart (automatic) IBIS import,
search, and browse facilities, model administration has become remarkably simple. Continuing on the theme, ease of use for
simulation has been improved with the introduction of a new ‘subtract waveform’ feature to visualize the result
of what-if analysis. For power integrity, the power plane
impedance calculation has been vastly enhanced in order to help the user to optimize selection and placement of decoupling
capacitors. CR-5000 10.0 is available from May 2007. For more information about CR-5000 10.0 visit Zuken Webpage.
March 27,2007
CIM-Team and Zuken Launch the 2007 Version of E³.series,
Including New Module: E³.formboard
March 27th, 2007 - Munich, Germany and Westford, MA, USA
– CIM-Team and parent company, Zuken, the engineering consulting company; have announced the availability of E³.series
2007. The advancements in the latest version of the Windows-based electrical control design and documentation suite include
functionality improvements relating to 3rd party integration and increased ease of use and productivity. Most notably, the
new version signals the launch of a new formboard module for manufacturing cable harnesses. Improvements in 3rd Party Compatibility
Advancing
integration within both the tool flow and 3rd party environments is top of the agenda for CIM-Team and Zuken. The latest version
of E³.series includes enhancements to the certified SAP interface, along with support of 3D-MCAD data in STEP AP203/214
Format and MicroStation data. The improved SAP interface allows organizations to quickly and easily modify master records
without having to enter the SAP environment. In addition, users can also edit component and classification material master
data directly within E³.series using the online synchronization interface. Having a common data entry area means that component SAP and design data only needs to be
entered once, increasing product quality and design efficiency. The new functionality to output panel data into STEP AP203/214 format enables transferring of design data to create
three-dimensional models in 3D-MCAD environments. This allows the user to front load the completion of tasks such as collision
checking with mechanical parts, saving valuable time downstream in the design process. The bi-directional support of DGNdirect data for MicroStation has also been incorporated into
the latest version of E³.series. This will allow organizations where MicroStation is dominantly used, to benefit from
E³.series’ object orientated technology. Companies in the Civil Engineering, Oceanic and Utilities industries are
set to benefit the most from this functionality. Enhanced
Workflow with E3.formboard
To support the custom wire and cable harness market, E³.formboard
is being launched. This additional integrated module of the E³.series has been designed for the creation of nailboard
displays required in producing wire and cable harnesses. E3.formboard makes it possible to create connector tables automatically,
graphically display manufacturing and displayed lengths, apply automatic stretching and compressing to cables, as well as
rotate cable branches. As with all other modules in the E³.series, the displayed view data of an object in a project
with E3.formboard is always consistent with the schematic and additional documents. Ease of Use and Productivity
Significant advancements
to increased ease of use and productivity, come in the form of the ability to copy, insert and modify structural parts of
a project. Using this functionality, entire panels can now be copied repeatedly and adapted to specific requirements. With
larger installations, complete machinery and plant structures can be copied. With “Shared Sheets” in E3.panel, specific regions of different panels can be
displayed with individual scaling, making it significantly easier to wire between panels.
The ease of use enhancements
detailed in this document cover just a small number of the 50 new functions now available within E³.series 2007.
Shipping of E³.series 2007 began in March ‘07; to find out more information visit www.cim-team.de or www.zuken.com/e3 .
March 19,2007
Zuken Offers Free
Footprint Design Data for Altera’s Cyclone III FPGA Family within Zuken’s CR-5000 Enterprise Wide Design Suite
March 19th, 2007 - Munich, Germany and Westford, MA, USA –
Zuken, the engineering consulting company, today announced the availability of free footprint data for Altera Corporation’s
recently announced low-cost Cyclone III FPGA family. Zuken’s CR-5000 enterprise wide design solution users can download
the Cyclone III footprint design templates, eliminating the task of manually entering footprint data into their CR-5000 libraries.
“At Zuken we see it as an important objective to do everything
we can to facilitate the adoption of new technology for our customers. Through our partnership with Altera, we are continuing
to provide the integration needed within the electronics industry for our customers to remain competitive in the marketplace,”
said Werner Rissiek, Zuken General Manager Engineering Europe. The
Cyclone III family is Altera's third-generation of low-cost FPGAs offering lower power with greater logic, memory, and
multiplier densities than previous generations. The availability of the footprint data as a free download from Zuken is another
means to enable the efficient adoption of this new technology. “Like
Zuken, we are committed to providing technology that allows our customers to easily develop innovative products at the lowest
cost. The availability of free Cyclone III footprint data from Zuken meets this goal and further eliminates the barriers of
designing with programmable logic,” said Danny Biran, Vice President of Product and Corporate Marketing at Altera. Free downloads are available for Zuken customers with a LinkZ login. Visit www.zuken.com/linkz
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